个人简介
雷光寅，博士，复旦大学研究员，本科毕业于浙江大学，博士毕业于美国弗吉尼亚理工大学。曾在美国福特汽车公司全球研发中心与上海蔚来汽车工作10余年，负责新能源汽车电机控制器研发项目，研究领域集中在功率半导体模块封装、可靠性验证及失效分析，发表论文20余篇，获得30余项国际发明专利与申请。
研究方向
1.新型电子封装材料
2.功率半导体模块封装技术
3.集成化功率模块封装工艺
4.半导体模块可靠性及失效机理分析
代表性成果
1.Li Jiang, Thomas Guangyin Lei, Khai D.T. Ngo, Guo-Quan Lu*, and Shufang Luo, “Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement”, IEEE Transactions on Components and Packaging Technologies, Vol. 4, No. 5, pp. 751-761, 2014
2.Thomas Guangyin Lei*, Jesus Noel Calata, Guo-Quan Lu, Xu Chen, and Shufang Luo, “Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (> 100 mm2) Chips”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 1, pp. 98-104, 2010
3.Puqi Ning, Thomas Guangyin Lei, Fei (Fred) Wang*, Guo-Quan Lu, Khai D. T. Ngo, and Kaushik Raiashekara, “A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module”, IEEE Transactions on Power Electronics, Vol. 25, No. 8, pp. 2059-2067, 2010.
4.Thomas Guangyin Lei*, Jesus Noel Calata, Khai D. T. Ngo, and Guo-Quan Lu, “Effects of Large Temperature Cycling Range on Direct Bond Aluminum Substrate”, IEEE Transactions on Device and Materials Reliability, Vol. 9, No. 4, pp. 563-568, 2009
5.Guangcheng Dong, Guangyin (Thomas) Lei, Xu Chen*, Khai Ngo and Guo-Quan Lu, “Edge tail length effect on reliability of DBC substrates under thermal cycling,” Soldering & Surface Mount Technology, Vol. 21, No. 3, pp. 10-15, 2009
6.Li Yan, Zengping Xing, Zhiguang Wang, Tao Wang, Guangyin Lei, Jiefang Li, D. Viehland*, “Direct measurement of magnetoelectric exchange in self-assembled epitaxial BiFeO3-CoFe2O4 nanocomposite thin films”, Applied Physics Letters, 94, 192902 (2009)
7.John G. Bai, Thomas G. Lei, Jesus N. Calata, Guo-Quan Lu*, “Control of Nanosilver Sintering Attained Through Organic Binder Burnout”, J. Mater. Res., vol. 22, no. 12, pp. 3494-3500, Dec. 2007
8.Tao Wang, Xu Chen*, Guo-Quan Lu, Guangyin Lei, “Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection”, J. Electronic Materials, Vol. 36, No. 10, pp. 1333-1340. 2007
9.Thomas G. Lei*, Jesus Calata, Shufang Luo, Guo-Quan Lu, and Xu Chen, “Low-temperature sintering of nanoscale silver paste for large-area joints in power electronics modules”, Key Engineering Materials, Vol 353, pp. 2948-2953. 2007
10.Guo-Quan Lu*, Jesus N. Calata, Guangyin Lei, and Xu Chen, “Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices,” Proceedings of 8th International Conference on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2007, April 15th – 18th, London, UK, pp. 609-613, 2007
11.Kewei Xiao, Guangyin Lei, Khai D.T. Ngo, and Guo-Quan Lu*, “Effect of Heating Rate on Bonding Strength of Pressure-Free Sintered Nanosilver Joint”, International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), pp. 565-570, 2015
12.Guo-Quan Lu*, Meihua Zhao, Guangyin Lei, Jesus N. Calata, Xu Chen, and Susan Luo, “Emerging lead-free, high-temperature die-attach technology enabled by low-temperature sintering of nanoscale silver pastes”, Electronic Packaging Technology & High Density Packaging, ICEPT-HDP’09, Beijing, pp. 461-466, 2009
13.John G. Bai, Jesus N. Calata, Guangyin Lei, and Guo-Quan Lu*, “Thermomechanical reliability of low-temperature sintered silver die-attachment”, The tenth Inter. Conf. on Thermal and Thermomechanical Phenomena in Electronics Systems, ITHERM 06’. pp. 1126-1130, 2006
14.T. Wang, G. Lei, X. Chen*, L. Guido, Khai Ngo, G-Q Lu,“Improved performance of high-power LED by using low-temperature sintered chip attachment”, Electronic Packaging Technology & High Density Packaging, ICEPT-HDP’09, Beijing, China, pp. 581-584, 2009
15.Puqi Ning, Guangyin Lei, Fred Wang* and Khai D.T. Ngo, “Selection of Heatsink and Fan for High-Temperature Power Modules under Weight Constraint, Applied Power Electronics Conference and Exposition, Twenty-Third Annual IEEE, Austin, TX, pp. 192-198, 2008
